* Optional internal pull-ups for SD/MMC pins in DTS
* Selectable on‑chip LDO channel for SD/MMC power (can be disabled)
* Added several sensor/driver modules to generic ESP32 device configurations so that they become part of the SDKs
* SD card mount now prints card information for clearer diagnostics
* Fix for bug DTS boolean parsing. Improved tests to catch these issues.
* Expanded SDK integration test to include new modules and headers
* Modularized packaging to generate per‑module build files and include driver assets
* **New Features**
* Added a full SDK integration test suite with a minimal sample app and automated multi-platform build/run flows.
* Added a new CLI build tool to orchestrate SDK download, build, packaging, and device install/run.
* **Documentation**
* Added typography design token suggestion to ideas.
* **Chores**
* Updated CI to run SDK integration prep and test steps.
* Adjusted build artifact paths, license mappings, and repository ignore rules (including .tactility).
Ken Van Hoeylandt